According to a report from China’s Taiwan Economic Daily, China’s semiconductor industry is speeding up its pace of increasing its self-manufacturing rate. Although Huawei has been suppressed by the new ban, it has set up an exclusive department to cut into panel driver ICs. It is reported from the market that the chip testing machine purchased by Huawei is in place. It is expected to start mass production of driver ICs in 2020 to increase self-sufficiency and impact existing supply chains such as Novatek and Duntech.
Both Novatek and Duntech are Huawei’s driver IC suppliers. Novatek has never commented on a single customer for Huawei’s acceleration of its drive IC production rate; Duntek said that market competitors will always exist and continue to maintain technological R&D innovation and strength to cope with external environmental challenges.
The industry pointed out that Huawei’s HiSilicon even the most advanced 5nm Kirin series mobile phone chips can be independently developed. The driver IC technology is far less than that of mobile phone chips. It does not need to be produced at TSMC and can be produced with SMIC’s process.
Naijatechnews.com has learned that Taiwanese media said that Huawei will start research and development of panel driver ICs in 2019, and cooperate with BOE. Its first HiSilicon OLED driver IC has begun trial production.
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