Nvidia taps Samsung for advanced 2.5D chip packaging

Thanks to the AI boom, Samsung flagged over 900 percent profit in the first quarter of 2024. In an exciting development, Samsung scored 2.5D package volume for Nvidia AI (artificial intelligence) semiconductors.

Samsung’s Advanced Package Business Division secured Nvidia as a customer. It will provide interposers and 2.5D packages (I-Cube) while HBM and GPU wafer production will be outsourced to other companies.

2.5D packaging is a technology that horizontally places semiconductor dice (CPU, GPU, I/O, HBM, etc.) on an interposer. Samsung calls it I-Cube, while TSMC calls this technology Chip-on-Wafer-on-Substrate (CoWoS).

A source familiar with the matter at Samsung said, “Samsung Electronics is receiving 2.5D package volume from Nvidia and is mass-producing it. HBM and GPU production are being done by other companies.”

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