Samsung Electro-Mechanics gears up for AI revolution

Samsung Electro-Mechanics, a subsidiary and supplier to Samsung, is gearing up for a booming AI market. In a new report, Business Korea revealed that the company aims to produce FC-BGA (Flip Chip-Ball Grid Array) for AI servers in 2H24.

According to the info, Samsung Electro-Mechanics commenced mass production of semiconductor package substrates for AI PCs. A North America-based global semiconductor firm is said to be the receiver of these substrates.

The report further states that the Korean company has secured the initial target yield and passed customer performance evaluations. Samsung Electro-Mechanics has achieved a satisfactory level of products of performance for on-device AI devices.

On-device AI devices such as AI PCs require high-performance chips capable of extensive calculations. Therefore, substrates must support high performance, hence, Samsung Electro-Mechanics increased the area and reduced the line width in new products.

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