On September 28th, according to foreign media reports, in previous reports, foreign media mentioned that Intel, which is considering OEM chips from other manufacturers, has already handed over the OEM orders for 180,000 wafer GPUs in 2021. TSMC will use the latter’s 6nm process.
The latest foreign media reports show that in addition to the 180,000 GPU foundry orders, TSMC’s 3nm process that has not yet been put into production is also expected to receive Intel’s orders .
Foreign media said in the report that TSMC’s 3nm process has prepared 4 waves of production capacity, most of the first wave of production capacity will be reserved for major customer Apple, and the next 3 waves of production capacity will also be booked by many manufacturers, including Intel.
Intel will be among the capacity bookers, which means that from the perspective of foreign media, TSMC’s 3nm process will receive Intel’s orders. However, in the report, foreign media did not disclose which wave of TSMC’s 3nm process capacity will be booked by Intel.
Intel’s chips are currently produced by themselves. In the second-quarter earnings analyst conference call on July 23, Intel CEO Robert Swan revealed that they are considering OEM chips from other manufacturers. If they need to use other manufacturers’ process technology, They are also prepared to do that. They will have more choices and more flexibility by adopting other manufacturers’ process technology. When the process is backward, they can try other options instead of making them all by themselves.
Soon after the news appeared that Intel was considering handing over the chips to other manufacturers for foundry, foreign media reported that they had placed orders for 180,000 wafer GPUs to TSMC.
TSMC’s 3nm process is currently under R&D and has not yet been put into production, but the R&D is progressing as planned. They plan to risk trial production in 2021 and large-scale production in the second half of 2022.
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